TECH

According to rumors, the IPhone 18 Pro A20 chip received a radical redesign, 2 -nm FAB Process

Dies on the Land-Rinse Credit: TSMC

>>> * Class = “Hidden-XS”> 0 Span> gum span> uc span> & nbsp; 🤔 perhaps

A20 chip, widely expected, debuts in the iPhone 18 Pro and folding iPhone will use the new packaging technique on the technology of manufacturing the chip tsmc.

Rumors about the generation of iPhone 18 are already spreading, although we still have to see the iPhone 17 range. Nevertheless, the future model may be the future model Pack some changes in the packaging. The iPhone 16 line.

Comment on the chip covers two questions. will use the N3P process of the third generation.The process, which is reported, will be the use of A20 is called N2, and is also the first generation process. Theoretically, a reduction in dying can help A20 be approximately 15% faster than the A19.

should also be more effective, using about 30% less power than its predecessor.

The use of a 2-nanometer for the iPhone 18 is not a new hearing, since it has already circulated for several months. For example, in March, Analyst Min-Chi Kuo believed that all IPhone 18 models would use the 2-Nanometer process, while in September 2024 he thought that he would be limited only by Pro models.

packages design

, as always, a decrease in chip size will be useful. However, according to rumors, the new physical design of the chip can give Apple even more advantages.

In the PU notes, he believes that Apple will use a new multi-color level of TSMC (WMCM) level. They say that the new process of packaging the chips places memory directly on the plate.

This would bring the memory to the processor, graphic processor and neural engine that will use it. Therefore, this will increase the throughput and performance.

Changing the packaging using shorter transit can also provide other advantages, including the launch of the hardware cooler and with the best battery life.

it was also mentioned in the past when one Weibo leaves offers it as an idea back in October 2024. At that time, it was proposed that the change in the package would allow the use of individual dying to combine a small package, allowing for various combinations of CPU and arrogance, provided that they connect a small package.

the PU Note does not necessarily contribute to rumors about A20 chips and the generation of iPhone 18. They, however, help to make previous rumors more genuine.

Evaluation of rumors

🤔

possible

Leave a Reply