Memory of iPhone 20th-anniversary can make intelligence Siri and Apple Lightanines.
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The 20THANIVERSARY IPHONE STANDS TO OFFER AMAPER AME In-device processing with a change in memory potentially increases the speed of the response of artificial intelligence in jumps and borders. His self-developed chips based on artificial intelligence, he can soon make other serious changes to increase performance.According to EtNews sources, Apple seriously considers the possibility of adding mobile memory with high throughput (HBM) to its iPhone 2027 range. This will include the iPhone 20TH-year, which is expected to include other changes in the display and batteries.
The use of HBM would be a big change for Apple, as this is a method that requires laying DRAM layers. The packaging increases the signal transmission speed and, therefore, the passage strip, which makes it much faster and easier for processors for access and data protection from the store.
HBM is usually connected to the application processor, but there is a possibility that it is connected to a graphic processor that can be used for processing AI. This is actually what Unified Memory does in Apple Silicon Mac models.
The report source insists that Apple will use the HBM on the iPhone in 2027, since it “considers the change in the design” of his application processor to make it more useful for processing artificial intelligence. The source adds that the connection of the memory to the GPU is also “likely”.
Strong opportunity
in the report believes that Apple has already discussed the plan with suppliers In memory, such as Samsung and SK Hynix. Both create their own HBM mobile modules using their own packaging technologies, and mass production is expected after 2026.
SK Hynix, it is reported that it is called Vertical Wire Fean Out (VFO), while Samsung Electronics does this under the name of the vertical stack Cu-Post (VCS).
In the case of Apple, reports appeared in December that Apple is working with Samsung with a faster memory for the iPhone. The intention was to create a larger DRAM package to increase the number of connectors, increasing memory throughput.
Samsung and SK Hynix will probably fight with teeth and a nail to ensure the custom of Apple for their HBM mobile modules. It is expected that there will be tough competition, since each company will be able to expand its existing HBM operation in the server market for smartphones.
technology technique of the device
This includes changes in the display, such as the transition to the FINFET 16-nanometer for the DREPED DISPLE (DDI) chip to make it much more effective. Technology changes can also eliminate the frame, bending all four sides of the display.
The implementation of the camera will also be complicated, since the screen must transmit light, not worsening the quality of the camera image.
current theories for the implementation of technology include the use of transparent polyimide as an OLED substrate material, as well as the use of special lenses to reduce optical losses from OLED pixels.
is also expected that Samsung will use the new M16 material for the iPhone 18 displays, and can create user material for the device of the 20th anniversary.
Other rumors also include the use of 100% silicon material without graphite for a cathode of batteries, which can increase the productivity and service life of the battery.
with AI, which has high processing requirements, and, therefore, the power, any savings or other improvements to the battery will inevitably help to make the models more impressive.
Evaluation of rumors
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