The next year, Tim Hardvik
iPhone 18 will use the process of manufacturing 2-nanometers in the next generation of TSMC in combination with the modern new packaging method, and the world's leading factory has already installed a special production line for Apple in anticipation of mass production in 2026. src = “/wp-content/uploads/1e619280EF115C15C32156EE42801627C.jpg”/>
According to previous reports, the Apple A20 chip in the iPhone 18 models will switch from the previous information (integrated fan) to the package) WMCM (Mudule Mudule Wafer-Level). Technically, the differences between the two packaging methods are quite amazing.
Information allows you to integrate the components, including memory, in the package, but more focus on one DIE package, where the memory is usually attached to the main SOC (for example, DRAM, placed on top or next to CPU and cores of the graphic processor). It is optimized to reduce the size and increase the performance of individual chips.
WMCM, on the other hand, exceeds the integration of several chips in the same bag (hence the part of the “multi-chip-module”). This method allows more complex systems, such as processors, graphic processors, DRAM and other user accelerators (for example, AI/ML chips) to be tightly integrated into one package. It provides greater flexibility at the disposal of various types of chips, folding them vertically or placing side by side, as well as optimize the relationship between them. TSMC, as a rule, builds new FABS when it needs to increase production capacities for processing significant orders for chips, and TSMC is expanded mainly for 2 -NM technology.
To serve its main client, Apple, TSMC created a special production line on its FAB Chiayi P1, where by 2026 it is expected that by 2026 it is expected that by 2026 it is expected that 10,000 units will be reached by 2026. According to the Apple Ming-Chi Kuo analyst, only the PRO models in the iPhone 18 series will probably use the 2nd generation processor technology in the next generation due to cost problems. Kuo also believes that in the iPhone 18 Pro 12 GB of RAM will be presented as a result of a new packaging method.
Terms, such as 3NM and 2NM, describe generations of chips production technologies, each of which has its own set of design and architecture rules. As these numbers are reduced, they usually indicate a smaller size of the transistor. Smaller transistors allow you to fall more by one chip, which usually leads to an increase in the processing speed and increase the efficiency of electricity.
last year’s iPhone 16 series is based on the design of the A18 chip, created using a 3-nm second generation process. Meanwhile, this year, the upcoming iPhone 17 line is expected to use the A19 chips technology, which is probably based on an updated 3-nanometer process called N3P. Compared to earlier versions of 3NM chips, N3P chips provide increased performance efficiency and increased density of the transistor.
Related review: iPhone 18tag: digitimereled forum: iPhone [17 comments]
